(ISSN 2689-5846)
Recent Progress in Materials (ISSN 2689-5846) is an international peer-reviewed Open Access journal published quarterly online by LIDSEN Publishing Inc. This periodical is devoted to publishing high-quality papers that describe the most significant and cutting-edge research in all areas of Materials. Its aim is to provide timely, authoritative introductions to current thinking, developments and research in carefully selected topics. Also, it aims to enhance the international exchange of scientific activities in materials science and technology.
Recent Progress in Materials publishes original high quality experimental and theoretical papers and reviews on basic and applied research in the field of materials science and engineering, with focus on synthesis, processing, constitution, and properties of all classes of materials. Particular emphasis is placed on microstructural design, phase relations, computational thermodynamics, and kinetics at the nano to macro scale. Contributions may also focus on progress in advanced characterization techniques.
Main research areas include (but are not limited to):
Characterization & evaluation of materials
Metallic materials
Inorganic nonmetallic materials
Composite materials
Polymer materials
Biomaterials
Sustainable materials and technologies
Special types of materials
Macro-, micro- and nano structure of materials
Environmental interactions, process modeling
Novel applications of materials
Publication Speed (median values for papers published in 2023): Submission to First Decision: 5.3 weeks; Submission to Acceptance: 12.6 weeks; Acceptance to Publication: 7.5 days (1-2 days of FREE language polishing included)
Special Issue
Recent Advances in 2D Materials
Submission Deadline: April 30, 2024 (Open) Submit Now
Guest Editor
Ghulam Dastgeer, Professor, Ph.D.
Department of Physics and Astronomy, Sejong University, Seoul, Republic of Korea
Research Interests: Nano devices, electronic devices as biosensors
About This Topic
Dear Colleagues,
We have experienced an era of newly synthesized 2D materials and their uses in a wide range of electronic for the sesning system; the Industrial 4.0 era has already begun. World’s electronic industries are at the forefront of research and development in response to new demands from academia and industry. Gathering fresh ideas and knowledge in emerging spintronic components and electronic devices is both timely and required. New electronic materials in low-dimensional structures provide alternatives to traditional materials that are smaller, more efficient, and safer for the environment. We anticipate that researchers will continue to contribute to this subject. This Special Issue strives to provide a thorough list of world's cutting-edge spintronics and electrical components and equipment. The Special Issue will include original research, reviews, and highly regarded articles.
Prof. Dr. Ghulam Dastgeer
Guest Editor
Keywords
Manuscript Submission Information
Manuscripts should be submitted through the LIDSEN Submission System. Detailed information on manuscript preparation and submission is available in the Instructions for Authors. All submitted articles will be thoroughly refereed through a single-blind peer-review process and will be processed following the Editorial Process and Quality Control policy. Upon acceptance, the article will be immediately published in a regular issue of the journal and will be listed together on the special issue website, with a label that the article belongs to the Special Issue. LIDSEN distributes articles under the Creative Commons Attribution (CC BY 4.0) License in an open-access model. The authors own the copyright to the article, and the article can be free to access, distribute, and reuse provided that the original work is correctly cited.
Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). Research articles and review articles are highly invited. Authors are encouraged to send the tentative title and abstract of the planned paper to the Editorial Office (rpm@lidsen.com) for record. If you have any questions, please do not hesitate to contact the Editorial Office.
Welcome your submission!
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