Review on Some Important Research Progresses in Biodegradable Plastics/Polymers
Abstract
(ISSN 2689-5846)
Recent Progress in Materials (ISSN 2689-5846) is an international peer-reviewed Open Access journal published quarterly online by LIDSEN Publishing Inc. This periodical is devoted to publishing high-quality papers that describe the most significant and cutting-edge research in all areas of Materials. Its aim is to provide timely, authoritative introductions to current thinking, developments and research in carefully selected topics. Also, it aims to enhance the international exchange of scientific activities in materials science and technology.
Recent Progress in Materials publishes original high quality experimental and theoretical papers and reviews on basic and applied research in the field of materials science and engineering, with focus on synthesis, processing, constitution, and properties of all classes of materials. Particular emphasis is placed on microstructural design, phase relations, computational thermodynamics, and kinetics at the nano to macro scale. Contributions may also focus on progress in advanced characterization techniques.
Main research areas include (but are not limited to):
Characterization & evaluation of materials
Metallic materials
Inorganic nonmetallic materials
Composite materials
Polymer materials
Biomaterials
Sustainable materials and technologies
Special types of materials
Macro-, micro- and nano structure of materials
Environmental interactions, process modeling
Novel applications of materials
Publication Speed (median values for papers published in 2023): Submission to First Decision: 5.3 weeks; Submission to Acceptance: 12.6 weeks; Acceptance to Publication: 7.5 days (1-2 days of FREE language polishing included)
Special Issue
Multi-Scale Modeling and Characterization of Functional Materials
Submission Deadline: February 29, 2024 (Open) Submit Now
Guest Editor
Zhong Hu, Ph.D., Professor
South Dakota State University, Brookings, United States
Research Interests: Multi-scale material modeling and characterization; Design of composites and nano-composites; Characterization of materials/composites/nanostructured thin films and coatings; Mechanical strength evaluation and failure prediction; Metal forming processing design/testing/modeling/optimization; Solid mechanics; Experimental and computational modeling; Materials characterization; Metal forming process
About This Topic
Given the rapid development of materials science and technology, it is a necessary to understand their structures, properties, and the integration of structure-property relationships with processing, design, and fabrication. The traditional trial-and-error experimental approaches are time-consuming and expensive, and sometime impossible. Multi-scale materials modeling combines existing and emerging methods from diverse scientific disciplines to bridge the wide range of time and length scales inherent in many fundamental phenomena and processes in materials science and engineering. This Special Issue aims to bring together experts and researchers in computational modeling of materials to demonstrate how novel developments in recent years have transformed the field from a descriptive approach to modeling the properties and functions of complex materials under realistic constraints. An appropriate link between electronic-structure theory and statistical methods is necessary to describe the physics and chemistry that govern material properties and processes under realistic temperature, pressure, and environmental conditions. This special issue covers but is not limited to various modeling techniques, such as quantum mechanics, molecular dynamics, Monte Carlo method, finite element analysis, or combination of them in various research scales, such as macro-, micro-, nano-, and electronic structures, their macro-mechanics, nano-mechanics, interphase, physical and chemical interaction, and structure/process/property modeling of the novel materials and functional materials, and the possible development and use of the materials in novel and specific applications.
Keywords
quantum mechanics, molecular dynamics, finite element analysis, Monte Carlo, computer modeling, multiscale modeling, functional materials, novel materials, material design, material structure property relationship, etc.
Manuscript Submission Information
Manuscripts should be submitted through the LIDSEN Submission System. Detailed information on manuscript preparation and submission is available in the Instructions for Authors. All submitted articles will be thoroughly refereed through a single-blind peer-review process and will be processed following the Editorial Process and Quality Control policy. Upon acceptance, the article will be immediately published in a regular issue of the journal and will be listed together on the special issue website, with a label that the article belongs to the Special Issue. LIDSEN distributes articles under the Creative Commons Attribution (CC BY 4.0) License in an open-access model. The authors own the copyright to the article, and the article can be free to access, distribute, and reuse provided that the original work is correctly cited.
Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). Research articles and review articles are highly invited. Authors are encouraged to send the tentative title and abstract of the planned paper to the Editorial Office (rpm@lidsen.com) for record. If you have any questions, please do not hesitate to contact the Editorial Office.
Welcome your submission!
Publication
Review on Some Important Research Progresses in Biodegradable Plastics/Polymersby
Zhong Hu
and
Ruanbao Zhou
Abstract Biodegradable plastics/polymers may serve as a promising solution to the global problem of plastic waste accumulation in oceans and soil and may significantly reduce carbon emissions from the manufacturing process, since the materials used to make biodegradable polymers are carbon-based and emitted during the synthesis processes. This article [...] |
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